In order to increase light extraction efficiency, this light-emitting device (1) uses a lead frame (3, 4) configuring an electrode corresponding to one or multiple light-emitting elements (2), and a white resin molding package (5) formed integrally from a white resin, wherein the area in plan view of the white resin surface on a reflection surface flush with the mounting surface of the light-emitting element (2) is configured to be greater than the total area in plan view taken up by the light-emitting element and the surface of the lead frame (3, 4). Further, a stepped portion is formed on the surface of the lead frame (3, 4), and the stepped portion is filled in with white resin, increasing the area of the white resin surface on the reflective surface where the light-emitting element (2) is mounted.