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CN106910719A 封装件和制造封装件的方法 无效 - 撤回

封装件和制造封装件的方法
摘要：
提供了一种封装件和制造封装件的方法。所述封装件包括：基底，具有第一表面和背对第一表面的第二表面，基底中设置有多个焊盘；第一结合件和第二结合件，设置在基底上，第二结合件位于第一结合件的周围；芯片，设置在第一结合件上并通过引线电连接到所述多个焊盘；阻挡件，设置在第二结合件上；包封构件，设置在阻挡件的内侧以包封芯片第一结合件和引线。
摘要（英）：

The invention provides a package and a manufacturing method thereof. The package comprises a substrate, first and second engaging elements, a chip, a stopper and an encapsulating member. The substrate is provided with a first surface and a second surface back to the first surface. A number of pads are arranged in the substrate. First and second engaging elements are arranged on the substrate. The second engaging element is arranged around the first engaging element. The chip is arranged on the first engaging element and is electrically connected with a number of pads through a lead wire. The stopper is arranged on the second engaging element. The encapsulating member is arranged on the inner side of the stopper to enclose the chip, the first engaging element and the lead wire.

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