The invention provides a semiconductor package element and a method for manufacturing the same. The same semiconductor package element comprises a substrate, at least one chip, an encapsulation layer and at least one grid part, wherein the at least one chip is arranged on the substrate, the encapsulation layer is arranged on the substrate and encapsulates the at least one chip, and the at least one grid part is arranged in the encapsulation layer and comprises a plurality of main body parts, wherein the main body parts are opened and limited by a first rib and a second rib.