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发明公开
CN106920781A 半导体封装体和用于形成半导体封装体的方法 无效 - 驳回

半导体封装体和用于形成半导体封装体的方法
摘要：
本申请涉及半导体封装体和用于形成半导体封装体的方法。一个或多个实施例涉及一种包括集成散热片的半导体封装体以及形成半导体封装体的方法。在一个实施例中，该半导体封装体包括耦接至裸片焊盘的第一表面的半导体裸片。散热片耦接至该裸片焊盘的第二表面。包封材料包围该裸片和该裸片焊盘且在该散热片的一部分之上而定位。该散热片的底部部分可以保持从该包封材料露出。此外，该散热片的一部分可以从该包封材料的一侧延伸。
摘要（英）：

The invention relates to a semiconductor package body and a method for forming the same. One or more embodiments relate to the semiconductor package body containing an integrated heat sink and the method for forming the semiconductor package body. In one embodiment, the semiconductor package body comprises a semiconductor bare chip, wherein the semiconductor bare chip is coupled to a first surface of a bare chip bonding pad, the heat sink is coupled to a second surface of the bare chip bonding pad, an encapsulation material encircles the bare chip and the bare chip bonding pad and is positioned on a part of the heat sink, a bottom part of the heat sink can be maintained to be partially exposed out of the encapsulation material, and moreover, a part of the heat sink can extend from one side of the encapsulation material.

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