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发明授权
CN106960798B 封装基板的制作方法 有权

封装基板的制作方法
摘要：
本发明公开了一种封装基板的制作方法，其步骤包含：提供一承载板；形成一第一介电材料层于该承载板上，并图案化该第一介电材料层，使得一开口区形成于该第一介电材料层内，得以露出该承载板；形成一第一导电单元于该承载板上，使得位于该开口区的该第一导电单元的高度大于该第一介电材料层的厚度，并使得位于该第一介电材料层之上的该第一导电单元的宽度大于该开口区的宽度；形成一第二介电材料层于该第一导电单元上；形成一第二导电单元于该第二介电材料层上；形成一第三介电材料层于该第二导电单元上；移除该承载板，并移除该第一导电单元位于该开口区内的部分；以及形成一第四介电材料层，使其包覆该第一导电单元。
摘要（英）：

The invention discloses a production method of a packaging substrate. The production method comprises steps that a bearing plate is provided; a first dielectric material is formed on the bearing plate, and the patterning of the first dielectric material layer is carried out, and a first opening region is formed in the first dielectric material layer to expose the bearing plate; a first conductive unit is formed on the bearing plate, and the height of the first conductive unit in the opening region is greater than the thickness of the first dielectric material layer, and the width of the first conductive unit in the opening region is greater than the width of the opening region; a second dielectric material layer is disposed on the first conductive unit; a second conductive unit is formed on the second dielectric material layer; a third dielectric material layer is disposed on the second conductive unit; the bearing plate is removed, and the part of the first conductive unit in the opening region is removed; and a fourth dielectric material layer is formed, and is used to wrap the first conductive unit.

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