The invention belongs to the technical field of production of circuit boards, and relates to a method of using an additive process to manufacture a circuit board. The circuit board manufactured by the method of the invention can be widely applied to special fields such as a base station, 4G/5G communication, aerospace or a war industry, and has the advantages that the circuit signal transmission speed is improved, and the loss performance of the signals during the transmission process is reduced. Massive etching of copper can be avoided when the circuit board is manufactured through a graphene additive process, the consequent massive etching solution processing cost can also be avoided, and the printed board production cost is greatly reduced. The steps in the additive process are reduced by about 1/3 compared with those in a subtractive process, the production steps are simplified, and the production efficiency is improved. By using the additive process, flushing of wires and flushing of surfaces can be achieved, and a high-precision printed board such as an SMT can be manufactured.