A positioning method for two-dimensional inspection of solder paste printing is disclosed. With a 2D camera, a sample to be tested is positioned by the utilization of a standard sample. The method of the invention comprises the following steps: (a) obtaining at least a subtemplate from the standard sample; (b) using the subtemplate to match the sample to be tested so as to obtain an area to be tested corresponding to the subtemplate, and recording positional information of the area to be tested corresponding to the area to be tested; (c) obtaining at least a lower-order subtemplate from the subtemplate; (d) using the lower-order subtemplate to match the area to be tested of the sample to be tested so as to obtain at least a lower-order area to be tested corresponding to the lower-order subtemplate, and recording lower-order tested positional information of the lower-order area to be tested; and (e) combining the positional information of the area to be tested and the lower-order tested positional information to determine relative positional information of a target area to be tested when the lower-order area to be tested is the target area to be tested.