A system and method for manufacturing a micropillar array (20). A carrier (11) is provided with a layer of metal ink (20i). A high energy light source (14) irradiates the metal ink (20i) via a mask (13) between the carrier (11) and the light source. The mask is configured to pass a cross-section illuminated image of the micropillar array onto the metal ink (20i), thereby causing a patterned sintering of the metal ink (20i) to form a first subsection layer (21) of the micropillar array (20) in the layer of metal ink (20i). A further layer of the metal ink (20i) is applied on top of the first subsection layer (21) of the micropillar array (20) and irradiated via the mask (13) to form a second subsection layer (21) of the micropillar array on top. The process is repeated to achieve high aspect ratio micropillars 20p.