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发明授权
CN107004643B 电路基板及电子装置 有权

电路基板及电子装置
摘要：
电路基板(1)具有：绝缘基板(2)、被接合到绝缘基板(2)的一个主面的金属电路板(3)、被接合到绝缘基板(2)的与一个主面相反侧的主面的金属制的散热板(4)，散热板(4)的厚度为金属电路板(3)的厚度的3.75倍以上，散热板(4)所含有的金属粒子的粒径小于金属电路板(3)所含有的金属粒子的粒径，距绝缘基板(2)的相反侧的主面的距离越大则变得越小。
摘要（英）：

A circuit board (1) includes an insulating substrate (2); a metal circuit sheet (3) joined to a first principal surface of the insulating substrate (2); and a heat dissipating sheet (4) made of metal and joined to a second principal surface of the insulating substrate (2), the second principal surface being opposite the first principal surface. The thickness of the heat dissipating sheet (4) is at least 3.75 times the thickness of the metal circuit sheet (3). The size of metal grains contained in the heat dissipating sheet (4) is smaller than the size of metal grains contained in the metal circuit sheet (3), and decreases with increasing distance from the second principal surface of the insulating substrate (2).

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