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发明授权
CN107012465B 一种铜蚀刻液及其应用 有权

一种铜蚀刻液及其应用
摘要：
本发明提供一种铜蚀刻液及其应用，该铜蚀刻液含有含有氯化铜和过氧化氢，还含有1‑15wt％的3‑(2,2,2‑三氟乙氧基)吡啶‑2‑胺。本发明提供铜蚀刻液可应用于印制电路板中。本发明提供的铜蚀刻液整体具有较高的蚀刻速率和较少的侧蚀，配方合理，不易产生残渣，具有较好的工业应用价值。
摘要（英）：

The invention provides copper etching liquid and application thereof. The copper etching liquid comprises copper chloride and hydrogen peroxide, and further comprises 1-15 wt% of 3-(2,2,2-trifluoroethoxyl)-pyridine-2-amine. The copper etching liquid provided by the invention can be applied to printed-circuit boards, has high etching rate and is small in lateral etching overall, the formula is reasonable, residues are not prone to being generated, and the copper etching liquid has good industrial application value.

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