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发明公开
CN107017217A 半导体装置以及半导体装置的制造方法 有权

半导体装置以及半导体装置的制造方法
摘要：
本发明涉及半导体装置以及半导体装置的制造方法。其目的在于防止搭载于引线框的电子部件的位置偏移。半导体装置包括：引线框；以及电子部件，在与引线框的接合面具有凹凸结构，以引线框的一部分被嵌合于凹凸结构的状态与引线框接合。
摘要（英）：

The present disclosure provides a semiconductor device and a semiconductor device manufacturing method that may prevent positional displacement of an electronic component mounted on a lead frame. Namely, a semiconductor device includes a lead frame, and an electronic component that has a protruding or recessed structure at a bonding face that bonds to the lead frame and is bonded to the lead frame, in a state in which a portion of the lead frame is fitted together with the protruding or recessed structure.

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