The invention relates to the technical field of circuit board production, in particular to a method for detecting whether micro-guide through holes in a circuit board are subjected to interconnection failure. By design of a detection ring with a welding terminal, the welding terminal is welded to an independent PAD (bonding pad) where a blind hole is located, and then a tensile test machine is used to test a tension value needed for separating the independent PAD from a test board, whether a binding force between a hole inner coated copper layer of the blind hole and inner layer copper adjacent to the hole inner coated copper layer is qualified is judged through the tension value by combination with a phenomenon observed from a blind hole slice, and thus whether the blind hole is subjected to interconnection failure is judged. The method is simple and practical, a problem of whether the micro-guide through holes in the circuit board are subjected to interconnection failure is solved well, and thus a shipment risk can be controlled.