利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN107042467A 纳米深度损伤层机械化学磨削方法 无效 - 撤回

纳米深度损伤层机械化学磨削方法
摘要：
本发明提供一种纳米深度损伤层机械化学磨削方法，属于超精密加工技术领域。以氧化锌为结合剂，添加剂为氧化铈、氧化镁、氧化硅、碳化硅，磨粒为金刚石，尺寸为500‑1000nm。金刚石磨粒的重量百分含量为40‑50％，结合剂的重量百分含量为20‑25％，添加剂的重量百分含量为25‑40％。将压制的方块进行高温烧结，烧结时间2h，在350‑400℃下形成气孔，680‑700℃下玻璃态成形。超精密磨削时，砂轮转速为2200‑2400rpm，砂轮进给速率为4‑20μm/min。超精密磨削后，亚表面损伤层厚度可以达到45‑100nm，为纳米深度损伤层。本发明实现了硅片和玻璃纳米深度损伤层高效超精密磨削方法。
摘要（英）：

The invention provides a mechanical and chemical grinding method for a nanometer deep damage layer, belonging to the technical field of ultra-precision machining. Zinc oxide is adopted as a binding agent; cerium oxide, magnesium oxide, silicon oxide and silicon carbide are adopted as additives; and diamond with the particle size of 500-1000 nm is adopted as grinding particles; the weight percentage of the diamond grinding particles is 40-50%; the weight percentage of the binding agent is 20-25%; the weight percentage of the additives is 25-40%; a compacted cuboid block is sintered at high temperature, and sintering time is 2h; pores are formed at 350-400 DEG C; glassy state forming is performed at 680-700 DEG C; during ultra-precision grinding, the rotation speed of a grinding wheel is 2200-2400 rpm, and the feeding speed of the grinding wheel is 4-20 mu m/min; and after ultra-precision grinding, a sub surface damage layer can be 45-100 nm thick and is the nanometer deep damage layer. By adopting the mechanical and chemical grinding method, high-efficient ultra-precision grinding for silicon wafer and glass nanometer deep damage layers is realized.

0/0