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发明公开
CN107057344A 一种半芳香族聚酰胺树脂及其制备方法和由其组成的聚酰胺模塑组合物 无效 - 驳回

一种半芳香族聚酰胺树脂及其制备方法和由其组成的聚酰胺模塑组合物
摘要：
本发明公开了一种半芳香族聚酰胺树脂及其制备方法和由其组成的聚酰胺模塑组合物，由如下由如下组分组成：（A）20‑95wt%衍生自1,6‑己二胺和己二酸的PA66均聚物；（B）5‑80wt%衍生自1,6‑己二胺和对苯二甲酸的PA6T均聚物。其中，（A）+（B）=100wt%。本发明通过将一定量的PA66均聚物加入PA6T均聚物中，能够显著降低PA6T均聚物的熔点至分解温度以下，从而改善了PA6T均聚物的加工性能，制备得到的半芳香族聚酰胺树脂熔点降低，可进行正常加工，由该半芳香族聚酰胺树脂组成的聚酰胺模塑组合物加工性能好，且具有优异的表面特性，同时保持较低的吸水率等性能优点。
摘要（英）：

The invention discloses a semi-aromatic polyamide resin, a preparation method thereof and a polyamide molding compound prepared from the semi-aromatic polyamide resin. The semi-aromatic polyamide resin is prepared from (A) 20-95wt% of PA66 homopolymer derived from 1,6-hexamethylenediamine and adipic acid and (B) 5-80wt% of PA6T homopolymer derived from 1,6-hexamethylenediamine and terephthalic acid, wherein (A)+(B)=100wt%. According to the invention, a certain amount of PA66 homopolymer is added into the PA6T homopolymer, so that the melting point of the PA6T homopolymer can be obviously reduced to below decomposing temperature and the processing property of the PA6T homopolymer is improved; the melting point of the prepared semi-aromatic polyamide resin is reduced; the normal processing can be performed; the polyamide molding compound prepared from the semi-aromatic polyamide resin has an excellent processing property and has the performance advantages of excellent surface feature, lower water absorption, and the like.

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