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发明授权
CN107068663B 具有光接口的半导体芯片封装 有权 转让

具有光接口的半导体芯片封装
摘要：
具有光接口的半导体芯片封装。一种半导体封装包括：芯片，其具有第一表面和第二表面；模塑件，其被配置为包封所述芯片；垂直导电通道，其在穿过所述模塑件的同时电连接至形成在所述芯片的第二表面上的焊盘；布线图案，其电连接至形成在所述芯片的第一表面上的焊盘并且被配置为在所述半导体封装中执行电连接；光器件，其被布置在所述半导体封装的表面上以电连接至所述垂直导电通道；以及外部连接端子，其被配置为将所述半导体封装电连接至外部。
摘要（英）：

A semiconductor package (16) includes a chip (300) having a pad (312) formed on a first surface thereof; a via-substrate (600) including a via (610); a mold (400) configured to encapsulate the chip and the via-substrate; a vertical conductive channel (200a,b) connected to the via while passing through the mold; an optical device (110) arranged on a surface of the semiconductor package to be electrically connected to the vertical conductive channel; a wiring pattern (520) configured to electrically connect the via and the pad to each other; and an external connection terminal (530) configured to electrically connect the semiconductor package to the outside.

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