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发明公开
CN107075242A 具有优异电镀附着力的聚碳酸酯‑ABS类合金树脂组合物及包括其的模制品 有权

具有优异电镀附着力的聚碳酸酯‑ABS类合金树脂组合物及包括其的模制品
摘要：
本公开内容涉及一种具有优异的电镀附着力的聚碳酸酯‑ABS类合金树脂组合物和由其制造的模制品。更具体地说，本发明涉及由于包含35重量％至75重量％的聚碳酸酯树脂(a)、5重量％至35重量％的通过聚合平均粒径为0.6μm至1.5μm的共轭二烯橡胶、芳族乙烯基化合物和乙烯基氰化合物来制备的共聚物(b)、5重量％至20重量％的通过聚合平均粒径为0.2μm以上且小于0.6μm的共轭二烯橡胶、芳香族乙烯基化合物和乙烯基氰化合物来制备的共聚物(c)、5重量％至20重量％的通过聚合平均粒径为0.1μm至0.3μm的共轭二烯橡胶、芳族乙烯基化合物和(甲基)丙烯酸酯化合物来制备的共聚物(d)以及0至40重量％的芳族乙烯基化合物‑乙烯基氰化合物的共聚物(e)而具有优异的电镀附着力的聚碳酸酯‑ABS类合金树脂组合物，以及包含该聚碳酸酯‑ABS基合金树脂组合物的模制品。根据本公开内容，提供一种具有优异的电镀附着力和优异的机械性能的聚碳酸酯‑ABS类合金树脂组合物和包含该聚碳酸酯‑ABS类合金树脂组合物的模制品。
摘要（英）：

The present invention relates to a polycarbonate-ABS-based alloy resin composition having excellent plating adhesive strength, and a molded product thereof and, more specifically, to a polycarbonate-ABS-based alloy resin composition having excellent plating adhesive strength, and a molded product comprising the same, the composition comprising: (a) 35-75 wt% of a polycarbonate resin; (b) 5-35 wt% of a copolymer obtained by polymerizing a conjugated diene rubber having an average diameter of 0.6-1.5 [mu]m, an aromatic vinyl compound and a vinyl cyano compound; (c) 5-20 wt% of a copolymer obtained by polymerizing a conjugated diene rubber having an average diameter greater than or equal to 0.2 [mu]m and less than 0.6 [mu]m, an aromatic vinyl compound and a vinyl cyano compound; (d) 5-20 wt% of a copolymer obtained by polymerizing a conjugated diene rubber having an average diameter of 0.1-0.3 [mu]m, an aromatic vinyl compound and a (meth)acrylate compound; and (e) 0-40 wt% of an aromatic vinyl compound-vinyl cyano compound copolymer. According to the present disclosure, there is an effect of providing a polycarbonate-ABS-based alloy resin composition having excellent mechanical properties and excellent plating adhesive strength, and a molded product comprising the same.

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