A hardware shield device and an electronic device are provided. The device and electronic device include a shield can including an opening through which at least a part of a device element is exposed, a heat dissipation module including at least a part that is mounted on the opening, a cover member connected to one surface of the heat dissipation module, and a conductor arranged between the shield can and the cover member, the conductor surrounding both the opening and at least a part of a periphery of the heat dissipation module.