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CN107117577B 具有较低的温度灵敏度的微机电型压力装置 有权

具有较低的温度灵敏度的微机电型压力装置
摘要：
本公开涉及具有较低的温度灵敏度的微机电型压力装置，提供了一种微机电压力传感器装置(100)，其由帽状件区域(102)和半导体材料的传感器区域(101)形成。气隙(107)在传感器区域(101)和帽状件区域(102；103)之间延伸；掩埋空腔(109)在传感器区域(101)中的气隙下方延伸，并且在底部限定薄膜(111)。贯通沟槽(110)在传感器区域(101)内延伸并且横向限定容纳薄膜的灵敏部分(121)、支撑部分(120)和弹簧部分(122)，弹簧部分将灵敏部分(121)连接至支撑部分(120)。通道(123)在弹簧部分(122)内延伸并且将掩埋空腔(109)连接到第二区域(101)的面(101A)。
摘要（英）：

A micro-electro-mechanical pressure sensor device (100), formed by a cap region (102) and by a sensor region (101) of semiconductor material. An air gap (107) extends between the sensor region (101) and the cap region (102; 103); a buried cavity (109) extends underneath the air gap, in the sensor region (101), and delimits a membrane (111) at the bottom. A through trench (110) extends within the sensor region (101) and laterally delimits a sensitive portion (121) housing the membrane, a supporting portion (120), and a spring portion (122), the spring portion connecting the sensitive portion (121) to the supporting portion (120). A channel (123) extends within the spring portion (122) and connects the buried cavity (109) to a face (101A) of the second region (101). The first air gap (107) is fluidically connected to the outside of the device, and the buried cavity (109) is isolated from the outside via a sealing region (106B) arranged between the sensor region (101) and the cap region (102).

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