The invention discloses high heat radiation electronic equipment, and relates to the technical field of heat radiation. The high heat radiation electronic equipment is characterized in that an electronic component is surface-mounted on the upper surface of a printed circuit board; the electronic component is internally provided with more than one pad; the pads are made of heat conduction materials; each pad includes an internal end portion and an external end portion which are integrated as a whole body; and the external end portion is extended out from the electronic component, and then penetrates through a through hole in the printed circuit board to connect with the lower surface of the printed circuit board so as to enable the heat generated from the electronic component to conduct to the lower surface of the printed circuit board to improve the heat radiation efficiency of the electronic component and save the cost of manufacturing an extra radiator.