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发明公开
CN107204360A 半导体装置及半导体装置的制造方法 审中-实审

半导体装置及半导体装置的制造方法
摘要：
本发明提供容易微细加工的保护环部。还提供一种半导体装置，具备：半导体基板；有源区，其形成于半导体基板；以及保护环部，其在半导体基板形成于有源区的外侧，保护环部具有：保护环，其呈环状地形成在半导体基板的上表面；层间绝缘膜，其形成于保护环的上方；场板，其沿着保护环在层间绝缘膜的上方形成为环状；以及钨插塞，其沿着保护环形成为环状，贯穿层间绝缘膜而将保护环与场板连接。
摘要（英）：

Provided is a guard ring section to which a fine processing is easily applied. Provided is a semiconductor device comprising: a semiconductor substrate; an active region formed in the semiconductor substrate; and a guard ring section formed more outside than the active region in the semiconductor substrate, wherein the guard ring section includes: a guard ring formed in a circular pattern on an upper surface of the semiconductor substrate; an interlayer insulating film formed above the guard ring; a field plate formed in a circular pattern along the guard ring and above the interlayer insulating film; and a tungsten plug formed in a circular pattern along the guard ring and penetrating the interlayer insulating film to connect the guard ring and the field plate.

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