The invention relates to a method for applying an electrically insulating layer (10) to a metallic surface (11) and also to an electrical component with such a layer. It is envisaged in a first step (Ia/IIa) to apply a powdered high-temperature polymer (12) with an average particle diameter [D(v; 0.5)] in the range from 20 to 100 µm to the metallic surface (11) and in a second step (Ib/IIb) to expose the applied high-temperature polymer (13) to thermal radiation, wherein the metallic surface is earthed, so that electrical charges flow away.