The invention relates to a leadless high-heat resistance glue solution for producing copper-clad plates. Main raw materials of the glue solution include 30-60 parts of low brominated epoxy resin, 10-30 parts of high brominated epoxy resin, 5-10 parts of tetrafunctional epoxy resin, 20-40 parts of 4-(N-maleimido)phenol glycidyl ether, 2.5-4 parts of dicyandiamide, 0.05-0.2 parts of a curing accelerator, 20-50 parts of an inorganic filler and 0.5-2 parts of a silane coupling agent KH560, wherein the 4-(N-maleimido)phenol glycidyl ether is prepared from maleic anhydride, p-bromoaniline and glycidol. The FR-4 CCL copper-clad plates made by using the glue solution have excellent comprehensive performances and meet requirements of high-end PCB.