The invention provides a bump defect detection method. The method includes acquiring a first standard image; acquiring the black white image of an incomplete bare die; comparing the black white image of the incomplete bare die with the first standard image, defining the missing part as a white defect and filtering out the white defect, and detecting the bump defect on the surface of the incomplete bare die by means of a first algorithm; detecting the bump defect of a complete bare die with the same method or acquiring a second standard image; acquiring the grayscale image of the complete bare die; and comparing the grayscale image of the complete bare die with the second standard image, and screening the bump defect on the surface of the complete bare die according to a second algorithm. The surface defect scanning is carried out to the incomplete bare die, the black white image is obtained through the machine optical principle, the white defect is filtered by calling the algorithm, the size and area are controlled, so that the bump defect can be accurately scanned, and the efficiency and accuracy are greatly improved.