The invention provides a processing process for a PTC type heater. The processing process comprises the following concrete steps: preparing PTC thermal sensitive ceramic chips, preparing a bonding glue, pre-treating aluminum tubes and electrode slices, splicing electrode strips, arranging PTC thermal sensitive ceramic chips, moulding and pressing, and splicing wave-shaped radiating strips. Compared with the prior art, the processing process has the following beneficial effects: with the adoption of a slidable strip clamping bar of a stable chip arranging device, the spaces of the PTC thermal sensitive ceramic chips in the chip arrangement can be guaranteed to be the same and the artificial visual inspection is not required, so the chip arranging quality is improved; moreover, each of the PTC thermal sensitive ceramic chips can be guaranteed to be vertically arranged, and the phenomenon that the arranged PTC thermal sensitive ceramic chips are toppled over does not occur; and thus, the chip arranging quality is further guaranteed, and the chip arranging efficiency can be improved.