The invention discloses a method for processing hole positions on a ceramic panel. The method at least comprises the following steps: forming blank through holes of which the shapes are consistent with the designed shapes of hole positions and which have blank allowance by adopting a laser cutting way on to-be-processed hole positions of the ceramic panel; and cutting the blank allowance, caused by laser cutting, of the blank through holes by adopting a numeric control machining tool to form the hole positions of required sizes on the ceramic panel, wherein the cutting quantity of the numeric control machining tool is equal to the blank allowance of the blank through holes. According to the method disclosed by the invention, the processing periods of the hole positions on the ceramic panel can be effectively shortened; meanwhile, higher quality of the processed hole positions on the ceramic panel also can be ensured, and the production yield rate is increased.