A multi-step high-overload resonant accelerometer chip is composed of a silicon substrate and quartz tuning fork beams. The silicon substrate is composed of a peripheral support frame and an internal sensitive mass block. The support frame and the sensitive mass block are provided with overload stopping structures and are connected via a flexible support beam. The sensitive mass block on the silicon substrate is provided with an installation alignment mark and a vacant slot for installation and movement of the quartz tuning fork beams and that are symmetrically distributed on both sides of a non-sensitive directional axis and perpendicular to a tested acceleration direction. The acceleration is determined by a difference between the frequency changes of two quartz tuning fork beams. When the chip is subjected to overload impact acceleration, the overload stopping structure on the sensitive mass block comes into hard contact with the overload stopping structure on the support frame so as to prevent damage caused by the further deformation of the quartz tuning fork beams and the flexible support beam. The multi-step high-overload resonant accelerometer chip can reduce the influence and the damage of the harsh environment on the sensor, expands an application range, and has quasi-digital output, high precision and small volume.