The invention provides a method for producing an aluminum alloy electronic device with the excellent packaging airtightness and a method for improving the packaging airtightness of the aluminum alloy electronic device. The producing method comprises the steps that an electronic component is placed into an aluminum alloy shell, and gaps of the aluminum alloy shell are subjected to welding; weld joints formed during welding are cleaned; and cladding powder layers for covering the outer surfaces of the weld joints are arranged, and laser cladding is conducted while the cladding temperature is controlled not higher than a first temperature always, so that dense bonding layers are formed on the weld joints, wherein the first temperature is the temperature tolerance upper limit value of the electronic component. By adopting the method for producing the aluminum alloy electronic device with the excellent packaging airtightness and the method for improving the packaging airtightness of the aluminum alloy electronic device, the packaging airtightness of the aluminum alloy electronic device can be remarkably improved, the yield of the aluminum alloy electronic device can be remarkably increased, protection gas does not need to be additionally added, the cost is low, and operation is easy and convenient.