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发明授权
CN107452664B 从晶片揭除粘膜的方法及装置 有权

从晶片揭除粘膜的方法及装置
摘要：
本发明涉及一种从晶片揭除粘膜的方法，包括下列步骤：将其上带有粘膜的晶片以倾斜状态置于一个晶片支撑台，所述晶片支撑台包括一个底座和一个容纳晶片的倾斜支撑面；使用刀片将晶片上的粘膜从晶片边缘揭起；用一个压片手柄将晶片按压在晶片支撑台上，同时，用镊子将所述粘膜从所述晶片揭除；任选地，在“将其上带有粘膜的晶片以倾斜状态置于一个晶片的支撑台”之后，“使用刀片将晶片上的粘膜从晶片边缘揭起”之前，对置于晶片的支撑台的带有粘膜的晶片作失粘处理。还涉及用于从晶片揭除粘膜的装置。
摘要（英）：

The invention relates to a method for stripping an adhesive film from a wafer. The method comprises the following steps of putting the wafer with the adhesive film on a wafer support table in an inclined state, wherein the wafer support table comprises a base and an inclined support surface for accommodating the wafer; stripping the adhesive film on the wafer from the edge of the wafer by using a blade; pressing the wafer on the wafer support table by using a press handle and simultaneously stripping the adhesive film from the wafer by using tweezers; and optionally, after putting the wafer with the adhesive film on the wafer support table in the inclined state and before stripping the adhesive film on the wafer from the edge of the wafer by using the blade, carrying out debonding treatment on the wafer with the adhesive film put on the wafer support table. The invention further relates to a device for stripping the adhesive film from the wafer.

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