The invention discloses a solder paste silk-screen printing method used for an LED module. The method comprises the steps of plate etching, positioning, printing, forming and the like, and comprises the specific steps that a plate with a corresponding thickness is selected, the plate is etched to obtain through holes corresponding to the positions, where solder paste needs to be dispensed therein,of an LED base plate in a one-to-one correspondence mode, and then the plate is fixed to a silk-screen printer; then the LED base plate is arranged at the lower end of the plate and positioned through a positioning device, and meanwhile, the solder paste is arranged at the upper end of the plate; a roller of the silk-screen printer travels to coat the LED base plate with the solder paste; and finally, the plate and the LED base plate are separated, then a solder paste LED base plate with specific shapes printed therein is obtained, and then a chip is attached to the LED base plate to be roasted. According to the solder paste silk-screen printing method provided by the invention, the to-be-printed solder paste is printed on the blank base plate before solid phase crystallization by means of the printer, or fluorescent glue is printed on the base plate after solid phase crystallization, the LED production efficiency is improved, the uniformity of an obtained fluorescent layer or a solder paste layer is better, and the method has extremely high production and application values.