The invention provides a leveling method for hole filling printing ink on a printed circuit board. The method comprises the steps of providing a revolution belt which moves in a circular manner on a loop path, wherein the revolution belt performs a sticking step and a cleaning step in order in a circular manner on the loop path. In the sticking step, the revolution belt presses and comes into contact with hole filling printing ink on one surface of a printed circuit board so that the hole filing printing ink is stuck to the revolution belt; in the cleaning step, the printing ink stuck to the revolution belt is cleaned via a solution. The invention further provides a leveling device for hole filling printing ink on a printed circuit board, which implements the method. The method and the device can solve the problem of poor leveling efficiency of hole filling of printing ink at surfaces of a printed circuit board in the prior art.