The invention relates to a semiconductor package structure, which comprises a lead frame (1), wherein the lead frame (1) comprises a plurality of pins (1.1); a chip (3) is arranged on the pins (1.1) in an inverted manner and is provided with a cooling frame (4); the cooling frame (4) comprises a cooling panel (4.1) and elastic pins (4.2); the upper surface of the chip (3) is in contact with the lower surface of the cooling panel (4.1); the lead frame (1), the chip (2) and the cooling frame (4) are packaged into a molding compound (5); and the lower surfaces of the pins (1.1) and the lower surfaces of the elastic pins (4.2) are located in the same plane and exposed outside the molding compound (5). According to the semiconductor package structure, the heights from the lower surfaces of theelastic pins to the upper surface of the cooling frame are the same as that of a mold cavity, so that the condition that the lower surfaces of the elastic pins are exposed outside the molding compoundis ensured and the grounding function can be relatively reliably achieved through the cooling frame of the package structure.