The invention relates to a copper phosphate adsorbing material. The content of CuO is 56 to 60 weight percent, the content of PO2 is 32 to 35 percent, and the average particle size of copper phosphateparticles is 220 to 260nm. The preparation method comprises the following steps: mixing copper nitrate with deionized water, and stirring for a certain time to obtain a primary solution; mixing ammonium hydrogen phosphate with the deionized water and stirring for a certain time; adding sodium hydroxide into the solution and continuously stirring for a certain time to obtain a secondary solution;quickly adding the primary solution into the primary solution, then aging, putting the aged mixed solution into a water bath heating device, continuously stirring for a certain time and then filteringto obtain a primary solid product; washing the primary solid product with the deionized water, and then drying for a certain time to obtain a secondary solid product; putting the secondary solid product into a roasting furnace for roasting to obtain the copper phosphate adsorbing material. The copper phosphate adsorbing material disclosed by the invention has the advantages of low content of copper phosphate impurities, high purity, good particle size uniformity and good adsorption capacity for xanthate.