The invention discloses a power device for achieving dual-side heat dissipation and pressure equalization. By arranging a conductive contact sheet provided with a plurality of concave pool structures,the power device is divided into two parts to achieve dual-side heat dissipation; and by mechanical connection of spring pieces and concave parts of the concave pool structures, the concave part of each concave pool structure is sequentially connected with an upper molybdenum sheet, a chip, a lower molybdenum sheet, a silver cushion, a boss and a conductive substrate from top to bottom, so that each spring piece and each chip are independent to each other, the stress of the chip can be reduced through generating upward displacement by the corresponding spring piece when thermal stress appliedto one of the chips due to difference of structure or thermal expansion becomes larger, the other chips and other springs are not affected, and the stress balancing degree of the chip is improved. With the power device provided by the invention, the problem of low reliability of a power device package structure caused by poor heat dissipation performance and non-uniform bearing stress to an internal chip of a traditional power device package structure can be solved.