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发明授权
CN107778534B 一种复合导热填料及其制备方法和应用 有权 转让

一种复合导热填料及其制备方法和应用
摘要：
本发明涉及高分子导热材料的填充领域，具体公开一种复合导热填料及其制备方法和应用。所述复合导热填料包括SiO2、Al2O3和AlN，其中，所述SiO2与所述Al2O3的质量比为(4‑12)：1，且所述复合导热填料为类球形，且所述复合导热填料的球形度为0.7‑0.8。将各组分混合在惰性气氛下进行热处理，热处理条件为：温度：1550‑1750℃，时间：1‑3h。本发明所制备的复合填料可以直接用于高分子材料的填充，较相同成分的SiO2‑Al2O3‑AlN混合型复合导热填料对高分子材料的热导率提高19‑21％。
摘要（英）：

The invention relates to the field of polymer heat-conducting material filling, and particularly discloses a composite heat conducting filler, a preparing method thereof and applications of the filler. The composite heat conducting filler includes SiO2, Al2O3 and AlN, wherein the mass ratio of the SiO2 to the Al2O3 is (4-12):1, the filler is near spherical, and the degree of sphericity of the filler is 0.7-0.8. Components are mixed and subjected to heat treatment in an inert atmosphere, and the heat treatment is performed at 1550-1750 DEG C for 1-3 h. The prepared composite filler can be directly used for polymer material filling. Heat conductivity of the composite heat conducting filler for polymer materials is increased by 19-21% than that of SiO2-Al2O3-AlN mixed type composite heat conducting fillers having same components.

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