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发明公开
CN107779120A 一种压电复合材料用高粘接强度低温固化导电银胶及其制备方法 无效 - 驳回

一种压电复合材料用高粘接强度低温固化导电银胶及其制备方法
摘要：
本发明涉及一种压电复合材料用高粘接强度低温固化导电银胶及其制备方法。该导电银胶包括导电填料、基础树脂、固化剂和溶剂，所述导电填料为导电银粉，所述基础树脂为环氧树脂，所述固化剂为有机多胺类固化剂。进一步还可包括添加剂，所述添加剂为稀释剂、分散剂、增韧剂、偶联剂、催化剂、导电促进剂、固化型促进剂、附着力促进剂中的一种或多种。所述有机多胺类固化剂为单一多胺脂肪胺中的乙二胺、四乙烯五胺、三乙醇胺、二乙烯三胺、三乙烯四胺中的一种。本发明的导电银胶与市场上的相比，具有成本低、固化温度低、固化时间短、导电能力好、银层和复合材料之间及银层和焊点之间粘接强度高的优点，可广泛应用于复合材料焊接领域。
摘要（英）：

The invention relates to a high-adhesion-strength low-temperature curing conductive silver adhesive used for a piezoelectric composite material and a preparation method of the adhesive. The conductivesilver adhesive includes a conductive filler, basic resin, a curing agent and a solvent, wherein the conductive filler is conductive silver powder, the basic resin is epoxy resin, and the curing agent is an organic polyamine curing agent. The additive can further include an additive, and the additive is one or more selected from a diluent, a dispersant, a toughening agent, a coupling agent, a catalyst, a conductive accelerator, a curing accelerator, and an adhesion accelerator. The organic polyamine curing agent is one selected from ethylenediamine, tetraethylenepentamine, triethanolamine, diethylenetriamine, and triethylenetetramine of fatty amines of single polyamines. The conductive silver adhesive provided by the invention has the advantages of low costs, a low curing temperature, short curing time, good electrical conductivity, and high adhesion strength between a silver layer and a composite material as well as high adhesion strength between the silver layer and a welding spot compared with that of a market, and can be widely used in the field of welding of the composite material.

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