中科微点-全球专利检索

  1. Login
  2. Sign Up
Invention Publication
CN107799474A 被保护免受后面攻击的芯片 有权

被保护免受后面攻击的芯片
Abstract:
本公开涉及被保护免受后面攻击的芯片，例如，本公开涉及一种半导体芯片，该半导体芯片包括从前面到背面穿过该芯片的至少两个绝缘通孔(8)，其中，在该后面侧上，这些通孔连接至同一导电带(12)并且在该前面侧上，每个通孔通过电介质层(6)与导电焊盘(3，4)分离开。
Abstract(English):

The invention discloses a chip protected against backend attacks. A semiconductor chip includes at least two insulated vias passing through the chip from the front face to the rear face in which, on the side of the rear face, the vias are connected to one and the same conducting strip and, on the side of the front face, each via is separated from a conducting pad by a layer of a dielectric.

Public/Granted literature
Patent Agency Ranking
0/0