The invention relates to a light emitting device, which includes a substrate, a conductive layer set on an upper surface of the substrate and having a plurality of conductive layers in a first direction, each conductive layer including a connection portion and an element mounting portion connected to the connection portion on a first side surface; light emitting elements respectively configured tothe element mounting portions of the plurality of conductive layers; and bonding members respectively bonding the element mounting portions and the light emitting elements. Each conductive layer is provided with a suppressing portion on a second side surface of the element mounting portion opposite to the first side surface, and the suppressing portion generates a stress against the stress that is exerted when the light emitting element is mounted via the bonding member and that is intended to pull the light emitting element in the direction of the connection portion.