Provided are a structure for recording a disassembly of an electronic product, disassembly detection method, whole device testing method, and PCB. The structure for recording disassembly of an electronic product comprises: M GPIOs of a CPU; and a gating switch. The M GPIOs of the CPU respectively route to a surface layer of a PCB to form exposed copper portions. The exposed copper portion of each GPIO is separated into two sections (1, 2), wherein M ≥ 2. The M GPIOs respectively connect to a power terminal (VDD) via a resistor (R). The gating switch is configured to gate the exposed copper portion when pressed, and the exposed copper portion gated by the gating switch when initially pressed is different from the exposed copper portion gated by the gating switch when subsequently pressed. The gating switch is pressed when an electronic product is assembled into a bare device and springs back when the electronic product is disassembled. The structure can record and detect a disassembly operation on an electronic product, and can be further applied to whole device test for the electronic product, thereby solving a problem in which a fault caused by disassembling and maintaining the electronic product may not be identified during a sequential test on the electronic product.