The invention provides a chip type tantalum capacitor having a metal packaging structure and a packaging method of the chip type tantalum capacitor. The metal packaging structure is adopted. A bondingconducting glue layer wraps the tantalum chip and a metal housing wraps the bonding conducting glue layer. At the same time, one end of the tantalum chip is connected with a tantalum wire which is then led to the outside of the metal housing through a tantalum leading-out wire, so that the chip type tantalum capacitor having the metal packaging structure is formed. The tantalum wire and the tantalum wire leading-out wire are connected through welding and the welding point of the tantalum wire and the tantalum wire leading-out wire is disposed on the inner face of the metal housing. An insulation block sleeves the welding points of the tantalum wire and the tantalum wire leading-out wire. The bonding conducting glue fills between the insulation block and the tantalum chip and wraps the insulation block. Therefore, the space between the tantalum chip and the tantalum wire, the tantalum leading-out wire and the housing is relative fixed.