The invention discloses a manufacturing method of a circuit board used for an LED lamp band. The manufacturing method comprises the following steps: (1) selecting and using a copper foil with one surface adhered with an insulating film, adopting a copper foil rolling trimming device to trim the copper foil into a circuit pattern in the middle section of the circuit board in a rolling manner, and simultaneously preserving the insulating film from being damaged; (2) adopting the copper foil rolling trimming device to trim circuit patterns at two ends of the circuit board in a blanking manner onthe basis of the step (1), and simultaneously preserving the insulating film from being damaged; (3) placing copper bars on two sides of the circuit pattern of the circuit board as main wires; (4) adopting a laminating film rolling trimming machine to trim a pattern needing to preserve welding spots in the middle section of the circuit board in the rolling manner on a laminating film; (5) adoptinga laminating film blanking device to trim patterns needing to preserve welding spots at two ends of the circuit board in the blanking manner on the basis of the step (4); and (6) adopting a hot pressto press and adhere the laminating film through the treatment in the step (5) onto the circuit pattern manufactured in the step (3), wherein the patterns of the preserved welding spots on the laminating film correspond to the circuit patterns.