An anisotropic conductive film includes an insulating adhesive layer and conductive particles disposed thereon. Arrangement axes of the conductive particles having a particle pitch extend in a widthwise direction of the film, and the axes are sequentially arranged with an axis pitch in a lengthwise direction of the film. The particle pitch, axis pitch of the axes, and an angle θ of the axes relative the widthwise direction of the film are determined according to external shapes of terminals so 3 to 40 conductive particles are present on each terminal when a terminal arrangement region of an electronic component is superimposed on the film so a lengthwise direction of each terminal is aligned with the widthwise direction of the film. By using the film, stable connection reliability is obtained and an excessive increase in the density of the conductive particles is suppressed even in the connection of fine pitches.