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发明公开
CN107963815A 微晶玻璃及其基板 审中-实审

微晶玻璃及其基板
摘要：
本发明提供一种微晶玻璃及其基板，具有较高热导率以及实施化学钢化可形成较深的应力层。微晶玻璃，其成分按重量％组成含有：SiO 260～80％；Al2O3 4～20％；Li2O 0～15％；Na2O大于5％但小于或等于12％；ZrO2大于0但小于或等于5％；P2O5 0～5％；TiO2 0～6％。本发明的微晶玻璃在室温的热导率在2W/m·k以上，钢化后的维氏硬度为600kgf/mm2以上，压缩应力层的厚度为1μm以上。本发明的微晶玻璃或基板适用于便携式电子设备与光学设备等保护构件，尤其作为后盖板，具有较高热导率和强度，透明或可具有不同个性色彩。本发明的微晶玻璃还可以作为导热材料使用。
摘要（英）：

The invention provides microcrystalline glass and a substrate thereof, wherein the microcrystalline glass has high heat conductivity and can form a deep stress layer through chemical tempering. The microcrystalline glass includes, by weight, 60-80% of SiO2, 4-20% of Al2O3, 0-15% of Li2O, more than 5% and not more than 12% of Na2O, more than 0% and not more than 5% of ZrO2, 0-5% of P2O5 and 0-6% ofTiO2. The microcrystalline glass is higher than 2 W/m*k in heat conductivity at room temperature and is more than 600 kgf/mm<2> in Vickers hardness after tempering, and is more than 1 [mu]m in thickness of a compression stress layer. The microcrystalline glass and the substrate can be used as protective components, especially a back cover plate, of a portable electronic appliance and optical device, has high heat conductivity and intensity, and is transparent or can be processed in different individual colors. The microcrystalline glass also can be used as a heat conductive material.

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