The invention relates to a wire encapsulation device, and mainly solves the problems of very low efficiency, non-uniform encapsulation thickness and relatively large gap after encapsulation of an existing wire encapsulation device. The wire encapsulation device comprises a rack, an electrical cabinet, an operating panel and a characteristic mechanism, wherein the rack and the characteristic mechanism are arranged on the electrical cabinet, the rack is used for supporting the characteristic mechanism, the characteristic mechanism comprises a line press encapsulation mechanism, an adhesive tapeloading and cutting mechanism and a mobile line rolling mechanism, the operating panel is further arranged on the rack and comprises a button module and a display module, the button module is used forsetting action of the device, and the display module can be used for displaying state information of the device in real time. By the technical scheme that the operating panel is connected with a PLCinput end, the problem is solved very well, and the wire encapsulation device can be used for wire encapsulation.