Disclosed herein is a modular flooring assembly including a flooring component adhered to a first tray substrate and a second tray substrate which are interconnected to form an assembled tray substrate. The assembled tray substrate may be interconnected with additional assembled tray substrates to form a modular floor suitable for most flooring applications. The flooring component may be tile or wood or other materials commonly used in flooring applications. Conventional fill-in grout or a snap-in grout may be used with the modular flooring assemblies.