The invention discloses a manufacturing method of a double-sided aluminum substrate. The method comprises the steps of after the cutting of an aluminum plate, drilling a large hole with the radius thereof larger than that of a to-be-drilled hole at a hole position to be conducted on the aluminum plate; filling the ink in the large hole; baking the aluminum plate to cure the ink; grinding the ink protruding out of the surface of the aluminum plate and coarsening the surface of the aluminum plate; sequentially laminating and pressing an outer copper foil and the aluminum plate together through aprepreg so as to form a production plate; drilling a small hole at a position, corresponding to the to-be-drilled hole, in the production plate, wherein the circle center of the small hole coincideswith the circle center of the large hole; metalizing the small hole through the copper deposition process and the all-board electroplating process; sequentially preparing an outer circuit, manufacturing a solder-resistant layer, carrying out surface treatment and the molding treatment on the production plate, and preparing a double-sided aluminum substrate. The double-sided aluminum substrate manufactured by the method can realize interlayer interconnection. Meanwhile, the hole position is good in heat dissipation performance, and the product yield is improved.