The invention relates to the field of chemical compounds, and discloses an epoxy resin compound and application thereof. The epoxy resin compound is prepared from, by weight, 8-12% of epoxy resin, 3-7% of phenolic resin, 79-86% of inorganic filler, 1-1.5% of fire retardant, 0.05-0.1% of curing accelerator, 0.4-0.6% of inorganic ion capturing agent, 0.4-0.6% of silane coupling agent and 0.8-1% of low stress modifying agent, wherein the epoxy resin is at least one of bisphenol A type epoxy resin, bisphenol F type epoxy resin, linear phenolic epoxy resin, biphenyl type epoxy resin, open chain aliphatic epoxy resin, alicyclic epoxy resin and heterocyclic epoxy resin. The epoxy resin compound has a high glass-transition temperature (Tg), high reliability and good mobility and fire resistance.