The invention discloses a thin power module suitable for high frequency application. The thin power module comprises a thermal base plate, copper clad substrates and chips; the chips are connected with each other and connected with copper sheets through bonding wires; the front surface of the module is provide with an output terminal, a positive pole power terminal and a negative pole power terminal; the back surface of the module is provided with signal terminals; the chips are divided into an upper arm group and a lower arm group; upper arms and lower arms are in bilateral symmetry; each armincludes an even number of parallel-connected power units, wherein the power units are in longitudinal symmetry; each of the positive pole power terminal and the negative pole power terminal is provided with two pins; the pins of the terminals are in bilateral symmetry; the two pins of each power terminal are welded onto the copper sheet of the copper clad substrate in a longitudinal symmetry manner; and the power terminals are of bent vertical stack structures in the module. Whit the above structure adopted, the thickness of the power module can be reduced, and distributed inductance can bereduced and equalized.