A spindle according to an embodiment of the present invention is a spindle, which is rotatably installed to a head so as to support a nozzle sucking an electronic component, and comprises: an upper body coupled to the head and having a semispherical first contact surface formed at the lower end thereof; a lower body coupled to the nozzle, having a semispherical second contact surface which is formed at the upper end thereof and which can make a surface contact with the first contact surface, and installed to be tiltable with respect to the upper body; and a holding part installed to at least one between the upper body and the lower body to enable the lower body to be fixed to the upper body in a state where the first contact surface and the second contact surface are in contact with each other.