The present invention provides a method for manufacturing a multilayer ceramic electronic component with a good cutting side surface. The method for manufacturing the multilayer ceramic electronic component comprises the steps of making a mother block, wherein the mother block contains a plurality of laminated ceramic raw pieces and the internal electrode patterns respectively configured along a plurality of interfaces between the above ceramic raw pieces; cutting the mother block via the cutting lines along the first and second directions orthogonal with each other to obtain a plurality of raw chips, wherein the plurality of raw chips have a laminated structure, the internal electrodes are exposed via a cutting side surface cut and displayed along the cutting lines of the first direction,and the laminated structure is configured to have a plurality of ceramic layers and a plurality of internal electrodes that are not processed; aiming at the cutting side surface, using a cutting toolto cut; forming a ceramic protection layer that is not processed on the cutting side surface after the grinding processing to obtain a part main body that is not processed; and sintering the part main body that is not processed.