The invention discloses an epoxy permeable mold glue and application thereof. The permeable mold glue consists of a self-emulsifying compound amine type curing agent system, an epoxy resin system andan aqueous phase slurry pore-forming agent, wherein organic active matters of the self-emulsifying compound amine type curing agent system comprise 20wt% to 40wt% of phenolic amide/phenolic imine, 5wt% to 25wt% of cyclic polyamine/aromatic acylamino amide, 30wt% to 55wt% of polyamide and 0 to 15wt% of a thinner. At room temperature, the epoxy resin system and the curing agent system are uniformlymixed in proportion according to the mass ratio of 100: (50 to 100) for procuring for 2 to 10 min, the aqueous phase slurry pore-forming agent occupying 60% to 75% of total glue weight is added, and after the components are quickly and uniformly mixed, a through hole type permeable mold with relatively high strength can be formed through casting, so that the epoxy permeable mold glue can be applied to the fields of porous permeable molds, filter pressing materials, adsorption separation materials, grouting materials and the like.